Summary

The global Polyurethane Reactive (PUR) Adhesives in Electronics market is anticipated to witness significant expansion, growing from USD 4.35 billion in 2025 to USD 6.47 billion by 2032, reflecting a robust CAGR of 5.8%. The increasing demand for advanced adhesives in electronic manufacturing is a key factor driving market expansion.

Market Insights

PUR adhesives have emerged as an essential component in the electronics industry, ensuring the structural integrity and longevity of electronic devices. These adhesives provide excellent chemical resistance, high bond strength, and the ability to withstand temperature variations. The growing complexity of electronic assemblies, coupled with the demand for lightweight and miniaturized devices, has accelerated the adoption of PUR adhesives.

Key Market Drivers

1. Miniaturization & Lightweight Design – The increasing demand for compact and lightweight electronic devices has driven the adoption of PUR adhesives. Their ability to provide superior bonding strength while ensuring moisture and thermal resistance makes them an ideal choice for modern electronics.

2. Technological Advancements – Continuous innovations in adhesive formulations, including enhanced thermal and electrical conductivity, have further expanded the application of PUR adhesives in high-performance electronics.

3. Rising Demand in Automotive and Consumer Electronics – The surge in electric vehicles (EVs) and advanced consumer gadgets has significantly contributed to market growth, as these devices require reliable adhesive solutions for heat management and component bonding.

4. Enhanced Durability & Protection – The ability of PUR adhesives to provide insulation, moisture resistance, and mechanical strength ensures longevity in electronic components, boosting their adoption in industrial applications.

Business Opportunities

• Sustainability Focus – Manufacturers can capitalize on the demand for environmentally friendly and sustainable PUR adhesives, incorporating bio-based or low-VOC formulations.

• Expanding Applications in Emerging Markets – The increasing use of PUR adhesives in medical devices, telecommunications, and aerospace sectors presents significant growth potential.

• Partnerships & Collaborations – Strengthening alliances with electronics manufacturers and research institutions can enhance innovation and market penetration.

Regional Analysis

• Asia Pacific – This region dominates the PUR adhesives market due to its strong manufacturing base in China, Japan, and South Korea. The presence of leading electronics manufacturers and rapid technological advancements drive regional growth.

• North America – The fastest-growing market, driven by robust technological advancements and high demand for high-performance adhesives in the automotive, aerospace, and electronics industries.

• Europe – Strong environmental regulations and a growing emphasis on sustainable adhesive solutions have boosted market demand in this region.

• Middle East & Africa & Latin America – These regions are gradually witnessing increasing adoption of PUR adhesives, driven by expanding industrialization and infrastructure development.

Competitive Analysis

The PUR adhesives market for electronics is characterized by intense competition, with key players focusing on innovation, strategic acquisitions, and sustainability initiatives. Leading companies in this market include:

• Henkel AG & Co. KGaA

• 3M

• H.B Fuller

• Dow Chemical Company

• Sika AG

• Avery Dennison

• Master Bond Inc.

• Lord Corporation

• Huntsman Corporation

• Permabond

• DELO Industries Adhesives

• Panacol

• ITW Polymers Adhesives

Recent Developments

• H.B. Fuller Acquisition – H.B. Fuller acquired Apollo, a UK-based manufacturer of liquid adhesives, coatings, and primers, strengthening its presence in the European construction market.

• Henkel Product Launch – Henkel expanded its RE Range with two solvent-free, recyclable polyurethane systems, recognized for recyclability by RecyClass, reinforcing the company’s commitment to sustainable adhesive solutions.

• Bostik’s Expansion – The adhesive division of Arkema launched a PU sealants development program to meet the rising demand for high-performance sealing and bonding solutions in the construction sector.

Market Segmentation

• By Component Type: Thermal Conductive, Electrically Conductive, UV Curing, Others.

• By Application: Surface-mount Devices, Potting & Encapsulation, Conformal Coatings, Others.

• By Region: North America, Europe, Asia Pacific, Latin America, Middle East & Africa.

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Table of Contents

1. Executive Summary
1.1. Global PUR Adhesives in Electronics Market Snapshot
1.2. Future Projections
1.3. Key Market Trends
1.4. Regional Snapshot, by Value and Volume, 2024
1.5. Analyst Recommendations
2. Market Overview
2.1. Market Definitions and Segmentations
2.2. Market Dynamics
2.2.1. Drivers
2.2.2. Restraints
2.2.3. Market Opportunities
2.3. Value Chain Analysis
2.4. Porter’s Five Forces Analysis
2.5. COVID-19 Impact Analysis
2.5.1. Supply
2.5.2. Demand
2.6. PESTLE Analysis
3. Price Analysis, 2024
3.1. Global Average Price Analysis, by Component Type, US$ Per Unit, 2024
3.2. Prominent Factor Affecting PUR Adhesives in Electronics Prices
3.3. Global Average Price Analysis, by Region, US$ Per Unit
4. Global PUR Adhesives in Electronics Market Outlook, 2019 - 2032
4.1. Global PUR Adhesives in Electronics Market Outlook, by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
4.1.1. Key Highlights
4.1.1.1. Thermal Conductive
4.1.1.2. Electrically Conductive
4.1.1.3. UV Curing
4.1.1.4. Others
4.2. Global PUR Adhesives in Electronics Market Outlook, by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
4.2.1. Key Highlights
4.2.1.1. Surface-mount devices
4.2.1.2. Potting & Encapsulation
4.2.1.3. Conformal Coatings
4.2.1.4. Others
4.3. Global PUR Adhesives in Electronics Market Outlook, by Region, Value (US$ Bn) and Volume (Units), 2019 - 2032
4.3.1. Key Highlights
4.3.1.1. North America
4.3.1.2. Europe
4.3.1.3. Asia Pacific
4.3.1.4. Latin America
4.3.1.5. Middle East & Africa
5. North America PUR Adhesives in Electronics Market Outlook, 2019 - 2032
5.1. North America PUR Adhesives in Electronics Market Outlook, by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
5.1.1. Key Highlights
5.1.1.1. Thermal Conductive
5.1.1.2. Electrically Conductive
5.1.1.3. UV Curing
5.1.1.4. Others
5.2. North America PUR Adhesives in Electronics Market Outlook, by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
5.2.1. Key Highlights
5.2.1.1. Surface-mount devices
5.2.1.2. Potting & Encapsulation
5.2.1.3. Conformal Coatings
5.2.1.4. Others
5.2.2. BPS Analysis/Market Attractiveness Analysis
5.3. North America PUR Adhesives in Electronics Market Outlook, by Country, Value (US$ Bn) and Volume (Units), 2019 - 2032
5.3.1. Key Highlights
5.3.1.1. U.S. PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
5.3.1.2. U.S. PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
5.3.1.3. Canada PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
5.3.1.4. Canada PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
5.3.2. BPS Analysis/Market Attractiveness Analysis
6. Europe PUR Adhesives in Electronics Market Outlook, 2019 - 2032
6.1. Europe PUR Adhesives in Electronics Market Outlook, by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.1.1. Key Highlights
6.1.1.1. Thermal Conductive
6.1.1.2. Electrically Conductive
6.1.1.3. UV Curing
6.1.1.4. Others
6.2. Europe PUR Adhesives in Electronics Market Outlook, by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.2.1. Key Highlights
6.2.1.1. Surface-mount devices
6.2.1.2. Potting & Encapsulation
6.2.1.3. Conformal Coatings
6.2.1.4. Others
6.2.2. Attractiveness Analysis
6.3. Europe PUR Adhesives in Electronics Market Outlook, by Country, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1. Key Highlights
6.3.1.1. Germany PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.2. Germany PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.3. U.K. PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.4. U.K. PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.5. France PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.6. France PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.7. Italy PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.8. Italy PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.9. Turkey PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.10. Turkey PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.11. Russia PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.12. Russia PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.13. Rest of Europe PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.1.14. Rest of Europe PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
6.3.2. BPS Analysis/Market Attractiveness Analysis
7. Asia Pacific PUR Adhesives in Electronics Market Outlook, 2019 - 2032
7.1. Asia Pacific PUR Adhesives in Electronics Market Outlook, by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.1.1. Key Highlights
7.1.1.1. Thermal Conductive
7.1.1.2. Electrically Conductive
7.1.1.3. UV Curing
7.1.1.4. Others
7.2. Asia Pacific PUR Adhesives in Electronics Market Outlook, by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.2.1. Key Highlights
7.2.1.1. Surface-mount devices
7.2.1.2. Potting & Encapsulation
7.2.1.3. Conformal Coatings
7.2.1.4. Others
7.2.2. BPS Analysis/Market Attractiveness Analysis
7.3. Asia Pacific PUR Adhesives in Electronics Market Outlook, by Country, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1. Key Highlights
7.3.1.1. China PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.2. China PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.3. Japan PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.4. Japan PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.5. South Korea PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.6. South Korea PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.7. India PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.8. India PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.9. Southeast Asia PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.10. Southeast Asia PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.11. Rest of Asia Pacific PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.1.12. Rest of Asia Pacific PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
7.3.2. BPS Analysis/Market Attractiveness Analysis
8. Latin America PUR Adhesives in Electronics Market Outlook, 2019 - 2032
8.1. Latin America PUR Adhesives in Electronics Market Outlook, by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.1.1. Key Highlights
8.1.1.1. Thermal Conductive
8.1.1.2. Electrically Conductive
8.1.1.3. UV Curing
8.1.1.4. Others
8.2. Latin America PUR Adhesives in Electronics Market Outlook, by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.2.1. Key Highlights
8.2.1.1. Surface-mount devices
8.2.1.2. Potting & Encapsulation
8.2.1.3. Conformal Coatings
8.2.1.4. Others
8.2.2. BPS Analysis/Market Attractiveness Analysis
8.3. Latin America PUR Adhesives in Electronics Market Outlook, by Country, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.3.1. Key Highlights
8.3.1.1. Brazil PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.3.1.2. Brazil PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.3.1.3. Mexico PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.3.1.4. Mexico PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.3.1.5. Argentina PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.3.1.6. Argentina PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.3.1.7. Rest of Latin America PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.3.1.8. Rest of Latin America PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
8.3.2. BPS Analysis/Market Attractiveness Analysis
9. Middle East & Africa PUR Adhesives in Electronics Market Outlook, 2019 - 2032
9.1. Middle East & Africa PUR Adhesives in Electronics Market Outlook, by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.1.1. Key Highlights
9.1.1.1. Thermal Conductive
9.1.1.2. Electrically Conductive
9.1.1.3. UV Curing
9.1.1.4. Others
9.2. Middle East & Africa PUR Adhesives in Electronics Market Outlook, by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.2.1. Key Highlights
9.2.1.1. Surface-mount devices
9.2.1.2. Potting & Encapsulation
9.2.1.3. Conformal Coatings
9.2.1.4. Others
9.2.2. BPS Analysis/Market Attractiveness Analysis
9.3. Middle East & Africa PUR Adhesives in Electronics Market Outlook, by Country, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1. Key Highlights
9.3.1.1. GCC PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1.2. GCC PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1.3. South Africa PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1.4. South Africa PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1.5. Egypt PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1.6. Egypt PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1.7. Nigeria PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1.8. Nigeria PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1.9. Rest of Middle East & Africa PUR Adhesives in Electronics Market by Component Type, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.1.10. Rest of Middle East & Africa PUR Adhesives in Electronics Market by Application, Value (US$ Bn) and Volume (Units), 2019 - 2032
9.3.2. BPS Analysis/Market Attractiveness Analysis
10. Competitive Landscape
10.1. Company Market Share Analysis, 2024
10.2. Competitive Dashboard
10.3. Company Profiles
10.3.1. Henkel AG & Co. KGaA
10.3.1.1. Company Overview
10.3.1.2. Product Portfolio
10.3.1.3. Financial Overview
10.3.1.4. Business Strategies and Development
10.3.2. 3M
10.3.2.1. Company Overview
10.3.2.2. Product Portfolio
10.3.2.3. Financial Overview
10.3.2.4. Business Strategies and Development
10.3.3. H.B Fuller
10.3.3.1. Company Overview
10.3.3.2. Product Portfolio
10.3.3.3. Financial Overview
10.3.3.4. Business Strategies and Development
10.3.4. Dow Chemical Company
10.3.4.1. Company Overview
10.3.4.2. Product Portfolio
10.3.4.3. Financial Overview
10.3.4.4. Business Strategies and Development
10.3.5. Sika AG
10.3.5.1. Company Overview
10.3.5.2. Product Portfolio
10.3.5.3. Financial Overview
10.3.5.4. Business Strategies and Development
10.3.6. Avery Dennison
10.3.6.1. Company Overview
10.3.6.2. Product Portfolio
10.3.6.3. Financial Overview
10.3.6.4. Business Strategies and Development
10.3.7. Master Bond Inc.
10.3.7.1. Company Overview
10.3.7.2. Product Portfolio
10.3.7.3. Financial Overview
10.3.7.4. Business Strategies and Development
10.3.8. Lord Corporation
10.3.8.1. Company Overview
10.3.8.2. Product Portfolio
10.3.8.3. Financial Overview
10.3.8.4. Business Strategies and Development
10.3.9. Huntsman Corporation
10.3.9.1. Company Overview
10.3.9.2. Product Portfolio
10.3.9.3. Financial Overview
10.3.9.4. Business Strategies and Development
10.3.10. Others
10.3.10.1. Company Overview
10.3.10.2. Product Portfolio
10.3.10.3. Financial Overview
10.3.10.4. Business Strategies and Development
11. Appendix
11.1. Research Methodology
11.2. Report Assumptions
11.3. Acronyms and Abbreviations