Summary

Summary
Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.

According to APO Research, The global Plating for Microelectronics market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.

The US & Canada market for Plating for Microelectronics is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.

Asia-Pacific market for Plating for Microelectronics is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.

The China market for Plating for Microelectronics is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.

Europe market for Plating for Microelectronics is estimated to increase from $ million in 2024 to reach $ million by 2030, at a CAGR of % during the forecast period of 2025 through 2030.

The major global companies of Plating for Microelectronics include DOW, Mitsubishi Materials Corporation, Heraeus, XiLong Scientific, Atotech, Yamato Denki, Meltex, Ishihara Chemical and Raschig GmbH, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.

Report Includes
This report presents an overview of global market for Plating for Microelectronics, market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.

This report researches the key producers of Plating for Microelectronics, also provides the revenue of main regions and countries. Of the upcoming market potential for Plating for Microelectronics, and key regions or countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.

This report focuses on the Plating for Microelectronics revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Plating for Microelectronics market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Plating for Microelectronics revenue, projected growth trends, production technology, application and end-user industry.

Plating for Microelectronics segment by Company
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International

Plating for Microelectronics segment by Type
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others

Plating for Microelectronics segment by Application
MEMS
PCB
IC
Photoelectron
Others

Plating for Microelectronics segment by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

Study Objectives
1. To analyze and research the global status and future forecast, involving growth rate (CAGR), market share, historical and forecast.
2. To present the key players, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Plating for Microelectronics market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Plating for Microelectronics and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in market size), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Plating for Microelectronics.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.

Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Revenue of Plating for Microelectronics in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of Plating for Microelectronics company competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Plating for Microelectronics revenue, gross margin, and recent development, etc.
Chapter 8: North America (US & Canada) by type, by application and by country, revenue for each segment.
Chapter 9: Europe by type, by application and by country, revenue for each segment.
Chapter 10: China type, by application, revenue for each segment.
Chapter 11: Asia (excluding China) type, by application and by region, revenue for each segment.
Chapter 12: Middle East, Africa, and Latin America type, by application and by country, revenue for each segment.
Chapter 13: The main concluding insights of the report.

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Table of Contents

1 Market Overview
1.1 Product Definition
1.2 Plating for Microelectronics Market by Type
1.2.1 Global Plating for Microelectronics Market Size by Type, 2019 VS 2023 VS 2030
1.2.2 Gold
1.2.3 Zinc
1.2.4 Nickel
1.2.5 Bronze
1.2.6 Tin
1.2.7 Copper
1.2.8 Others
1.3 Plating for Microelectronics Market by Application
1.3.1 Global Plating for Microelectronics Market Size by Application, 2019 VS 2023 VS 2030
1.3.2 MEMS
1.3.3 PCB
1.3.4 IC
1.3.5 Photoelectron
1.3.6 Others
1.4 Assumptions and Limitations
1.5 Study Goals and Objectives

2 Plating for Microelectronics Market Dynamics
2.1 Plating for Microelectronics Industry Trends
2.2 Plating for Microelectronics Industry Drivers
2.3 Plating for Microelectronics Industry Opportunities and Challenges
2.4 Plating for Microelectronics Industry Restraints

3 Global Growth Perspective
3.1 Global Plating for Microelectronics Market Perspective (2019-2030)
3.2 Global Plating for Microelectronics Growth Trends by Region
3.2.1 Global Plating for Microelectronics Market Size by Region: 2019 VS 2023 VS 2030
3.2.2 Global Plating for Microelectronics Market Size by Region (2019-2024)
3.2.3 Global Plating for Microelectronics Market Size by Region (2025-2030)
4 Competitive Landscape by Players
4.1 Global Plating for Microelectronics Revenue by Players
4.1.1 Global Plating for Microelectronics Revenue by Players (2019-2024)
4.1.2 Global Plating for Microelectronics Revenue Market Share by Players (2019-2024)
4.1.3 Global Plating for Microelectronics Players Revenue Share Top 10 and Top 5 in 2023
4.2 Global Plating for Microelectronics Key Players Ranking, 2022 VS 2023 VS 2024
4.3 Global Plating for Microelectronics Key Players Headquarters & Area Served
4.4 Global Plating for Microelectronics Players, Product Type & Application
4.5 Global Plating for Microelectronics Players Commercialization Time
4.6 Market Competitive Analysis
4.6.1 Global Plating for Microelectronics Market CR5 and HHI
4.6.2 Global Top 5 and 10 Plating for Microelectronics Players Market Share by Revenue in 2023
4.6.3 2023 Plating for Microelectronics Tier 1, Tier 2, and Tier 3

5 Plating for Microelectronics Market Size by Type
5.1 Global Plating for Microelectronics Revenue by Type (2019 VS 2023 VS 2030)
5.2 Global Plating for Microelectronics Revenue by Type (2019-2030)
5.3 Global Plating for Microelectronics Revenue Market Share by Type (2019-2030)

6 Plating for Microelectronics Market Size by Application
6.1 Global Plating for Microelectronics Revenue by Application (2019 VS 2023 VS 2030)
6.2 Global Plating for Microelectronics Revenue by Application (2019-2030)
6.3 Global Plating for Microelectronics Revenue Market Share by Application (2019-2030)

7 Company Profiles
7.1 DOW
7.1.1 DOW Comapny Information
7.1.2 DOW Business Overview
7.1.3 DOW Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.1.4 DOW Plating for Microelectronics Product Portfolio
7.1.5 DOW Recent Developments
7.2 Mitsubishi Materials Corporation
7.2.1 Mitsubishi Materials Corporation Comapny Information
7.2.2 Mitsubishi Materials Corporation Business Overview
7.2.3 Mitsubishi Materials Corporation Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.2.4 Mitsubishi Materials Corporation Plating for Microelectronics Product Portfolio
7.2.5 Mitsubishi Materials Corporation Recent Developments
7.3 Heraeus
7.3.1 Heraeus Comapny Information
7.3.2 Heraeus Business Overview
7.3.3 Heraeus Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.3.4 Heraeus Plating for Microelectronics Product Portfolio
7.3.5 Heraeus Recent Developments
7.4 XiLong Scientific
7.4.1 XiLong Scientific Comapny Information
7.4.2 XiLong Scientific Business Overview
7.4.3 XiLong Scientific Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.4.4 XiLong Scientific Plating for Microelectronics Product Portfolio
7.4.5 XiLong Scientific Recent Developments
7.5 Atotech
7.5.1 Atotech Comapny Information
7.5.2 Atotech Business Overview
7.5.3 Atotech Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.5.4 Atotech Plating for Microelectronics Product Portfolio
7.5.5 Atotech Recent Developments
7.6 Yamato Denki
7.6.1 Yamato Denki Comapny Information
7.6.2 Yamato Denki Business Overview
7.6.3 Yamato Denki Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.6.4 Yamato Denki Plating for Microelectronics Product Portfolio
7.6.5 Yamato Denki Recent Developments
7.7 Meltex
7.7.1 Meltex Comapny Information
7.7.2 Meltex Business Overview
7.7.3 Meltex Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.7.4 Meltex Plating for Microelectronics Product Portfolio
7.7.5 Meltex Recent Developments
7.8 Ishihara Chemical
7.8.1 Ishihara Chemical Comapny Information
7.8.2 Ishihara Chemical Business Overview
7.8.3 Ishihara Chemical Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.8.4 Ishihara Chemical Plating for Microelectronics Product Portfolio
7.8.5 Ishihara Chemical Recent Developments
7.9 Raschig GmbH
7.9.1 Raschig GmbH Comapny Information
7.9.2 Raschig GmbH Business Overview
7.9.3 Raschig GmbH Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.9.4 Raschig GmbH Plating for Microelectronics Product Portfolio
7.9.5 Raschig GmbH Recent Developments
7.10 Japan Pure Chemical
7.10.1 Japan Pure Chemical Comapny Information
7.10.2 Japan Pure Chemical Business Overview
7.10.3 Japan Pure Chemical Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.10.4 Japan Pure Chemical Plating for Microelectronics Product Portfolio
7.10.5 Japan Pure Chemical Recent Developments
7.11 Coatech
7.11.1 Coatech Comapny Information
7.11.2 Coatech Business Overview
7.11.3 Coatech Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.11.4 Coatech Plating for Microelectronics Product Portfolio
7.11.5 Coatech Recent Developments
7.12 MAGNETO special anodes
7.12.1 MAGNETO special anodes Comapny Information
7.12.2 MAGNETO special anodes Business Overview
7.12.3 MAGNETO special anodes Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.12.4 MAGNETO special anodes Plating for Microelectronics Product Portfolio
7.12.5 MAGNETO special anodes Recent Developments
7.13 Vopelius Chemie AG
7.13.1 Vopelius Chemie AG Comapny Information
7.13.2 Vopelius Chemie AG Business Overview
7.13.3 Vopelius Chemie AG Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.13.4 Vopelius Chemie AG Plating for Microelectronics Product Portfolio
7.13.5 Vopelius Chemie AG Recent Developments
7.14 Moses Lake Industries
7.14.1 Moses Lake Industries Comapny Information
7.14.2 Moses Lake Industries Business Overview
7.14.3 Moses Lake Industries Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.14.4 Moses Lake Industries Plating for Microelectronics Product Portfolio
7.14.5 Moses Lake Industries Recent Developments
7.15 JCU International
7.15.1 JCU International Comapny Information
7.15.2 JCU International Business Overview
7.15.3 JCU International Plating for Microelectronics Revenue and Gross Margin (2019-2024)
7.15.4 JCU International Plating for Microelectronics Product Portfolio
7.15.5 JCU International Recent Developments
8 North America
8.1 North America Plating for Microelectronics Revenue (2019-2030)
8.2 North America Plating for Microelectronics Revenue by Type (2019-2030)
8.2.1 North America Plating for Microelectronics Revenue by Type (2019-2024)
8.2.2 North America Plating for Microelectronics Revenue by Type (2025-2030)
8.3 North America Plating for Microelectronics Revenue Share by Type (2019-2030)
8.4 North America Plating for Microelectronics Revenue by Application (2019-2030)
8.4.1 North America Plating for Microelectronics Revenue by Application (2019-2024)
8.4.2 North America Plating for Microelectronics Revenue by Application (2025-2030)
8.5 North America Plating for Microelectronics Revenue Share by Application (2019-2030)
8.6 North America Plating for Microelectronics Revenue by Country
8.6.1 North America Plating for Microelectronics Revenue by Country (2019 VS 2023 VS 2030)
8.6.2 North America Plating for Microelectronics Revenue by Country (2019-2024)
8.6.3 North America Plating for Microelectronics Revenue by Country (2025-2030)
8.6.4 U.S.
8.6.5 Canada

9 Europe
9.1 Europe Plating for Microelectronics Revenue (2019-2030)
9.2 Europe Plating for Microelectronics Revenue by Type (2019-2030)
9.2.1 Europe Plating for Microelectronics Revenue by Type (2019-2024)
9.2.2 Europe Plating for Microelectronics Revenue by Type (2025-2030)
9.3 Europe Plating for Microelectronics Revenue Share by Type (2019-2030)
9.4 Europe Plating for Microelectronics Revenue by Application (2019-2030)
9.4.1 Europe Plating for Microelectronics Revenue by Application (2019-2024)
9.4.2 Europe Plating for Microelectronics Revenue by Application (2025-2030)
9.5 Europe Plating for Microelectronics Revenue Share by Application (2019-2030)
9.6 Europe Plating for Microelectronics Revenue by Country
9.6.1 Europe Plating for Microelectronics Revenue by Country (2019 VS 2023 VS 2030)
9.6.2 Europe Plating for Microelectronics Revenue by Country (2019-2024)
9.6.3 Europe Plating for Microelectronics Revenue by Country (2025-2030)
9.6.4 Germany
9.6.5 France
9.6.6 U.K.
9.6.7 Italy
9.6.8 Russia

10 China
10.1 China Plating for Microelectronics Revenue (2019-2030)
10.2 China Plating for Microelectronics Revenue by Type (2019-2030)
10.2.1 China Plating for Microelectronics Revenue by Type (2019-2024)
10.2.2 China Plating for Microelectronics Revenue by Type (2025-2030)
10.3 China Plating for Microelectronics Revenue Share by Type (2019-2030)
10.4 China Plating for Microelectronics Revenue by Application (2019-2030)
10.4.1 China Plating for Microelectronics Revenue by Application (2019-2024)
10.4.2 China Plating for Microelectronics Revenue by Application (2025-2030)
10.5 China Plating for Microelectronics Revenue Share by Application (2019-2030)

11 Asia (Excluding China)
11.1 Asia Plating for Microelectronics Revenue (2019-2030)
11.2 Asia Plating for Microelectronics Revenue by Type (2019-2030)
11.2.1 Asia Plating for Microelectronics Revenue by Type (2019-2024)
11.2.2 Asia Plating for Microelectronics Revenue by Type (2025-2030)
11.3 Asia Plating for Microelectronics Revenue Share by Type (2019-2030)
11.4 Asia Plating for Microelectronics Revenue by Application (2019-2030)
11.4.1 Asia Plating for Microelectronics Revenue by Application (2019-2024)
11.4.2 Asia Plating for Microelectronics Revenue by Application (2025-2030)
11.5 Asia Plating for Microelectronics Revenue Share by Application (2019-2030)
11.6 Asia Plating for Microelectronics Revenue by Country
11.6.1 Asia Plating for Microelectronics Revenue by Country (2019 VS 2023 VS 2030)
11.6.2 Asia Plating for Microelectronics Revenue by Country (2019-2024)
11.6.3 Asia Plating for Microelectronics Revenue by Country (2025-2030)
11.6.4 Japan
11.6.5 South Korea
11.6.6 India
11.6.7 Australia
11.6.8 China Taiwan
11.6.9 Southeast Asia

12 Middle East, Africa, Latin America
12.1 MEALA Plating for Microelectronics Revenue (2019-2030)
12.2 MEALA Plating for Microelectronics Revenue by Type (2019-2030)
12.2.1 MEALA Plating for Microelectronics Revenue by Type (2019-2024)
12.2.2 MEALA Plating for Microelectronics Revenue by Type (2025-2030)
12.3 MEALA Plating for Microelectronics Revenue Share by Type (2019-2030)
12.4 MEALA Plating for Microelectronics Revenue by Application (2019-2030)
12.4.1 MEALA Plating for Microelectronics Revenue by Application (2019-2024)
12.4.2 MEALA Plating for Microelectronics Revenue by Application (2025-2030)
12.5 MEALA Plating for Microelectronics Revenue Share by Application (2019-2030)
12.6 MEALA Plating for Microelectronics Revenue by Country
12.6.1 MEALA Plating for Microelectronics Revenue by Country (2019 VS 2023 VS 2030)
12.6.2 MEALA Plating for Microelectronics Revenue by Country (2019-2024)
12.6.3 MEALA Plating for Microelectronics Revenue by Country (2025-2030)
12.6.4 Mexico
12.6.5 Brazil
12.6.6 Israel
12.6.7 Argentina
12.6.8 Colombia
12.6.9 Turkey
12.6.10 Saudi Arabia
12.6.11 UAE

13 Concluding Insights
14 Appendix
14.1 Reasons for Doing This Study
14.2 Research Methodology
14.3 Research Process
14.4 Authors List of This Report
14.5 Data Source
14.5.1 Secondary Sources
14.5.2 Primary Sources
14.6 Disclaimer